Arrangement for contacting an integrated circuit in a package
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United States of America Patent
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Feb 3, 2009
Grant Date -
May 25, 2006
app pub date -
Nov 18, 2005
filing date -
Nov 19, 2004
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An arrangement is provided for contacting an integrated circuit in a package by a contact plate arranged on a circuit carrier, wherein the package has contact locations on the contact plate side. In this context, the contact plate has contact vanes, which are formed such that they have a spring action directed normal to the circuit carrier and such that the contact vanes can be brought parallel to the circuit carrier by pressing the package against the contact vanes. The contact locations and contact vanes each establish an electrical connection with one another in the state in which they are pressed against the circuit carrier.
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