Dicing die adhesive film for semiconductor
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United States of America Patent
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Feb 3, 2009
Grant Date -
Nov 2, 2006
app pub date -
Apr 27, 2006
filing date -
Apr 28, 2005
priority date (Note) -
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Abstract
A dicing die adhesive film for semiconductor of the present invention has a 3-layered structure including a first adhesive layer attached on the back of a semiconductor wafer; a second adhesive layer attached onto the first adhesive layer; and a dicing film attached onto the second adhesive layer, and therefore has an advantage that it can ensure reliability of the semiconductor packaging process since it may prevent the die-flying phenomenon and the poor pickup of the die in the dicing process and maintain a sufficient adhesive force between the die and the substrate upon die boding.
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