Apparatus for heating a substrate in a variable temperature process using a fixed temperature chuck
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United States of America Patent
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Feb 3, 2009
Grant Date -
Aug 4, 2005
app pub date -
Feb 15, 2005
filing date -
Sep 10, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method is provided for heating a substrate in a process chamber using a heated chuck. In accordance with the method, the substrate is lowered onto the chuck and heated to a first temperature less than a temperature of the chuck. The substrate is then raised away from the chuck, and a process is carried out on the substrate while the substrate is supported above the chuck. The substrate is then lowered back to the chuck and heated to a second temperature greater than the first temperature for further processing of the substrate.
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