Microstructured arrangement for the bubble-free filling with a liquid of at least one system for draining off liquids, apparatus having such an arrangement and filing method

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United States of America Patent

PATENT NO 7485118
APP PUB NO 20050169778A1
SERIAL NO

11015333

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Abstract

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The present invention relates to a microstructure arrangement for the bubble-free filling with a liquid of at least one system for draining off liquids. The arrangement has an inlet for the arrangement to be connected to a system for the supply of liquids and at least one outlet for the arrangement to be connected to the at least one liquid-discharging system. The arrangement has a transition region, through which the liquid can be transported from the inlet to the at least one outlet. At a start of the transition region, at least one first microstructure element for producing a point with increased capillary force is provided, in order to achieve gap-free wetting of the areas bounding this point with increased capillary force, in particular side walls, a cover and/or a bottom.

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Patent Owner(s)

Patent OwnerAddress
BOEHRINGER INGELHEIM MICROPARTS GMBH44227 DORTMUND

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Blankenstein, Gert Dortmund , DE 70 1645
Marquordt, Claus Dortmund , DE 14 341
Peters, Ralf-Peter Bergisch-gladbach , DE 59 949

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