Solid-state image pickup device and manufacturing method thereof
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United States of America Patent
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Jan 20, 2009
Grant Date -
Dec 20, 2007
app pub date -
Jun 15, 2007
filing date -
Jun 15, 2006
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Abstract
of the second electroconductive type is formed on the outer layer portion of the first silicide layer, so that the depletion layer that extends from the joint plane when the solid-state image pickup device is turned ON does not reach the side surface of the element separating insulating film.
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