Low dielectric organosilicate polymer composite
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United States of America Patent
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Jan 20, 2009
Grant Date -
Jan 19, 2006
app pub date -
Aug 20, 2004
filing date -
Aug 21, 2003
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Abstract
Provided are a porous organosilicate polymer composite prepared by heating an organic/inorganic hybrid polymer in which an organosilicate polymer is chemically bonded to a radial pore-forming polymer ended with a hydrolyzable alkoxysilyl group and used as a core molecule, and a semiconductor device using an organosilicate polymer composite film including the porous organosilicate polymer composite. The organosilicate polymer composite film has a very low dielectric constant, and thus, is useful as a dielectric film of the semiconductor device.
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