System and method for design and fabrication of a high frequency transducer
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United States of America Patent
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Jan 6, 2009
Grant Date -
Aug 7, 2008
app pub date -
Apr 14, 2008
filing date -
May 25, 2004
priority date (Note) -
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Abstract
Techniques for fabricating high frequency ultrasound transducers are provided herein. In one embodiment, the fabrication includes depositing a copperclad polyimide film, a layer of epoxy on the copperclad polyimide film, and a polyvinylidene fluoride film on the epoxy. The assembly of materials are then pressed to bond the polyvinylidene fluoride film to the copperclad polyimide film and to form an assembly. The polyvinylidene fluoride film being one surface and the copperclad polyimide film being the other surface. The area behind the copperclad polyimide film surface is filled with a second epoxy, and then cured to form an epoxy plug.
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