Triplate planar slot antenna
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United States of America Patent
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Dec 30, 2008
Grant Date -
May 1, 2008
app pub date -
Oct 21, 2005
filing date -
Oct 22, 2004
priority date (Note) -
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Abstract
A triplate planar slot antenna formed by laying a ground plate, a lower layer side dielectric layer, a lower layer side copper-clad film substrate, an upper layer side dielectric layer, a slot plate and an upper layer side copper-clad film substrate sequentially from the bottom side, wherein a lower layer side copper foil piece is secured to the surface of a lower layer side insulating film by a joining technique not using adhesive, and an upper layer side copper foil piece is secured to the surface of an upper layer side insulating film by a joining technique not using adhesive. In a state where the copper foil pieces are removed, each insulating film has a dielectric constant in the range of 2.0-4.0, a tan .delta. in the range of 0.001-0.01, and a thickness of 25 .mu.m or less.
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