Method of wafer level packaging and cutting
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 30, 2008
Grant Date -
Jul 19, 2007
app pub date -
Jun 28, 2006
filing date -
Jan 18, 2006
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A packaging wafer has a plurality of cavities and a plurality of trenches on a front surface thereof. The packaging wafer is bonded to the element wafer, and a first cutting method is performed. Afterward a piece of tape is provided and is attached to the packaging wafer. Moreover, a second cutting process is performed and then the piece of tape is removed. Therefore, a wafer level package is formed. In addition, the wafer level package is divided into a plurality of individual packages.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully