Printed circuit board and method of manufacturing the same
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United States of America Patent
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Dec 30, 2008
Grant Date -
May 18, 2006
app pub date -
Oct 5, 2005
filing date -
Nov 12, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Provided is a method of manufacturing a printed circuit board. In an embodiment, the method includes forming a prepreg layer via a reel method, forming a conductive film for forming a circuit pattern on at least one surface of the prepreg layer; and forming a predetermined circuit pattern on the conductive film. In an embodiment, the prepreg layer has a thickness of at most about 0.15 mm and contains a fiber material and a resin material. In an embodiment, the content of the resin material in the prepreg layer is about 70% or less by volume. In an embodiment, the prepreg layer is composed of at least one prepreg layer.
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