Method of forming a sputtering target assembly and assembly made therefrom
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United States of America Patent
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Dec 23, 2008
Grant Date -
Apr 29, 2004
app pub date -
Oct 21, 2003
filing date -
Oct 21, 2002
priority date (Note) -
Expired
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Abstract
A method of forming a sputtering target assembly and the sputtering target assembly made therefrom are described. The method includes bonding a sputtering target to a backing plate at a low temperature. Also described is a method of forming a sputtering target assembly such that a gap is formed between the sputtering target and the backing plate. Also described is a method of forming a sputtering target assembly providing a mechanism to prevent unintended sputtering into the backing plate.
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