Diffusion and laser photoelectrically coupled integrated circuit signal line
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United States of America Patent
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Dec 2, 2008
Grant Date -
May 8, 2008
app pub date -
Aug 1, 2005
filing date -
Mar 15, 2005
priority date (Note) -
Expired
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Abstract
A diffusion and laser photoelectrically coupled integrated circuit signal line, wherein photoelectrically coupled pairs are formed on integrated circuit chips utilizing a diffusion light or a laser light emitted by LED or the photoelectrically coupled pairs are arranged in an array to form photoelectrically coupled matrixes on the chips are used as signal lines connecting integrated circuits; furthermore a light emission is made to hollow light emitter and placed on the integrated circuit chip; a hollow reflective sheet is located on the bottom surface of the chip and under the light emitting body where a send-receiving photosensitive module is disposed around and a hollow reflective sheet or a semitransparent diffusion sheet is placed over; and the same processed chips are stacked up. The present invention solves the problem of signal transmission bandwidth between the computer chips, increasing the present arithmetic capability and reducing the volume of the supercomputer.
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