Apparatus for wafer patterning to reduce edge exclusion zone
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 2, 2008
Grant Date -
Aug 31, 2006
app pub date -
May 12, 2006
filing date -
Nov 3, 2004
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An apparatus includes an edge expose unit for exposing an annular area in an edge exclusion zone of a wafer to radiation having a wavelength suitable for removing a film from the wafer in the annular area and a radiation modulator coupled to the edge expose unit for modulating the radiation to pattern the film in the annular area.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully