Electrical interconnection structure formation
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United States of America Patent
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Dec 2, 2008
Grant Date -
Mar 20, 2008
app pub date -
Nov 16, 2007
filing date -
Nov 10, 2005
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An electrical interconnection structure. The electrical structure comprises a substrate comprising electrically conductive pads and a first dielectric layer over the substrate and the electrically conductive pads. The first dielectric layer comprises vias. A metallic layer is formed over the first dielectric layer and within the vias. A second dielectric layer is formed over the metallic layer. A ball limiting metallization layer is formed within the vias. A photoresist layer is formed over a surface of the ball limiting metallization layer. A first solder ball is formed within a first opening in the photoresist layer and a second solder ball is formed within a second opening in the photoresist layer.
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