Anisotropic conductive adhesive
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United States of America Patent
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Nov 18, 2008
Grant Date -
Dec 29, 2005
app pub date -
Oct 5, 2004
filing date -
Jun 23, 2004
priority date (Note) -
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Abstract
The present invention discloses an anisotropic conductive adhesive comprising an insulating adhesive component and a number of conductive particles dispersed in the insulating adhesive component, wherein the insulating adhesive component contains a crosslinked rubber resin. The anisotropic conductive adhesive of the present invention prevents exfoliation of an adhesive or reduction in adhesive strength of circuit by minimizing its the heat-contraction occurring in the process of a polymerization or a hardening reaction when connecting micro-circuits, whereby a short circuit between adjacent electrodes can be prevented when connecting the circuits, and excellent connection reliability according to a long-term use is achieved.
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