Multi-layer polyimide films and flexible circuit substrates therefrom
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United States of America Patent
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Nov 18, 2008
Grant Date -
Jan 4, 2007
app pub date -
Jun 29, 2005
filing date -
Jun 29, 2005
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Abstract
A multi-layer polyimide film including two or more laminated polyimide film layers is provided, with at least one of the two or more polyimide film layers is obtained by imidizing a polyamic acid derived from the reaction of at least one aromatic diamine containing 1-100 mol percent of carboxy-4,4'-diaminobiphenyl represented by the following formula, ##STR00001## wherein m and n represent integers of 4 or less, including 0, and (m+n) is an integer of 1 or greater, and at least one aromatic tetracarboxylic dianhydride or a derivative thereof. Methods for obtaining a multi-layer polyimide film laminate can exhibit a peel strength of 10N/cm when laminated to a metal foil using an adhesive and can have a water absorption value of less than 3.0 weight percent.
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