Connecting member for surface mounting circuit
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United States of America Patent
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-
Nov 18, 2008
Grant Date -
Dec 27, 2007
app pub date -
Jun 22, 2006
filing date -
Jun 22, 2006
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A circuit pattern is formed on a printed circuit board, and a plating surface of a projecting stripe on a substrate is connected to the circuit pattern by soldering. Further, adhesive agent is filled in a gap between a coarsened surface of a non-circuit unit and the printed circuit board. When the adhesive agent is filled in the gap, the adhesive agent comes in an uneven portion of the coarsened non-circuit unit and is hardened in the recessed portion, so that a chemical bonding force of the adhesive agent itself and an anchoring effect act. For this reason, a fixing force and the bonding force increase.
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