Device package and methods for the fabrication and testing thereof

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United States of America Patent

PATENT NO 7449784
SERIAL NO

11590592

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the second surface to the layer, the via hole having a first perimeter at the first surface; (d) forming an aperture in the layer, wherein the aperture has a second perimeter within the first perimeter; and (e) providing a conductive structure for sealing the via structure. Also provided are sealed via structures, methods of detecting leakage in a sealed device package, sealed device packages, device packages having cooling structures, and methods of bonding a first component to a second component.

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Patent Owner(s)

Patent OwnerAddress
CUBIC CORPORATION9333 BALBOA AVENUE SAN DIEGO CA 92123

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fisher, John J Blacksburg, VA 26 1165
Rasnake, Larry J Blacksburg, VA 9 386
Sherrer, David W Radford, VA 107 4596

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