Substrate with slot
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United States of America Patent
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Nov 11, 2008
Grant Date -
Aug 10, 2006
app pub date -
Jan 27, 2006
filing date -
Feb 5, 2005
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The invention relates to a substrate with slot. The substrate of the invention comprises an active surface and a plurality of metal plates. The metal plates are formed on the active surface. Each metal plate has a first surface and a second surface. The first surface is connected to the active surface. At least one metal plate has at least one slot formed on the second surface. Therefore, according to the substrate with slot of the invention, a resin for connecting a chip and the metal plates can entirely seal sides and corners of the chip so as to prevent water or dust from entering the chip and protect the chip.
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