One-component hot-setting epoxy resin composition and semiconductor mounting underfill material
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United States of America Patent
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Nov 11, 2008
Grant Date -
Oct 21, 2004
app pub date -
Mar 29, 2002
filing date -
Mar 30, 2001
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Abstract
The present invention provides an one-pack thermosetting type epoxy resin composition which is useful as an underfilling material used when a flip chip or a semiconductor package comprised of a semiconductor element held on a carrier base being mounted onto a wiring substrate; which can omit a fluxing process as adopted for improvement of the bonding force of bumps or solder balls particularly at said mounting and exhibits a good voidless property even at a reflow temperature; and which can be also applied as an adhesive, a paint, a coating material, a sealing material, or the like.The one-pack thermosetting type epoxy resin composition of the present invention comprises as essential ingredients, a liquid epoxy resin and a carboxylic acid having two or more carboxylic groups in molecule as a curing agent.
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