Semiconductor package with heat sink
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United States of America Patent
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Nov 4, 2008
Grant Date -
Nov 20, 2003
app pub date -
Jun 16, 2003
filing date -
Sep 24, 2001
priority date (Note) -
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Abstract
A package is provided for a semiconductor device including a semiconductor device support substrate having at least one interconnect metal therein connectible to a ground and having at least one opening exposing the surface of the interconnect metal. A heat sink has elastic means integral therewith for cooperating with the opening to position and secure the heat sink to the semiconductor support substrate.
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