Semiconductor device and method of manufacturing the same
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United States of America Patent
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Nov 4, 2008
Grant Date -
May 3, 2007
app pub date -
Dec 13, 2006
filing date -
Jan 16, 2003
priority date (Note) -
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Abstract
A semiconductor device includes at least one semiconductor structure which has a plurality of external connection electrodes formed on a semiconductor substrate. An insulating sheet member is arranged on the side of the semiconductor structure. Upper interconnections have connection pad portions that are arranged on the insulating sheet member in correspondence with the upper interconnections and connected to the external connection electrodes of the semiconductor structure.
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