Ratio of open area to closed area in panels for electronic equipment enclosures
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United States of America Patent
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Oct 21, 2008
Grant Date -
Aug 9, 2007
app pub date -
Oct 10, 2006
filing date -
Oct 10, 2005
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of providing an electronic equipment enclosure having a plurality of panels, including identifying at least one panel through which air is intended to flow, determining the design parameters of the identified panel, and providing an electronic equipment enclosure that includes the identified panel, constructed according to the determined design parameters. Determining the design parameters of the identified panel includes first establishing a maximum ratio of open area to closed area of between 60% and 70% and then determining one or more other parameters of the design of the identified panel in view of the established maximum ratio of open area to closed area. Other parameters include the material of which the identified panel is to be constructed, its thickness, and its rigidity. Specific enclosures benefiting from the design process are also described.
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