Stacked memory and manufacturing method thereof
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United States of America Patent
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Oct 7, 2008
Grant Date -
Jan 4, 2007
app pub date -
Sep 8, 2006
filing date -
Jul 31, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
To mount a TSOP on an interposer substrate, leads provided to the TSOP are joined to pads of the interposer substrate by a thermosetting conductive resin, and the TSOP exclusive of the leads is joined to ground layers formed in the interposer substrate by a thermosetting conductive resin. The interposer substrates with the TSOPs mounted thereon are stacked in eight layers in such a manner that the TSOPs face downward. Then, leads of the upper interposer substrate are joined to pads formed in the rear face of the lower interposer substrate by a thermosetting conductive resin, so that the interposer substrates adjacent in a vertical direction are connected.
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