Method for centering a sputter target onto a backing plate and the assembly thereof
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United States of America Patent
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Oct 7, 2008
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N/A
app pub date -
Sep 26, 2003
filing date -
Sep 26, 2003
priority date (Note) -
Expired
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Abstract
A method for aligning the sputter target onto a backing plate having a peripheral arcuate-shaped flange on its bonding surface to provide an aligned and uniform solder bonded interface; and the sputter target/backing plate assembly so produced.
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