Socket assembly for testing semiconductor device
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United States of America Patent
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Sep 30, 2008
Grant Date -
Aug 3, 2006
app pub date -
Aug 4, 2005
filing date -
Jan 28, 2005
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A socket assembly for testing semiconductor devices includes a socket board electrically connected to an outside testing device, and a socket guide which covers the socket board. The socket guide has an open part to receive the semiconductor device and allows pins on the semiconductor device to couple with connection pins on the socket board. A spacer may be interposed between the socket board and the socket guide to maintain a predetermined distance between the semiconductor device and the socket board. In this manner, the balls or the leads of each semiconductor device may be pressed onto connection pins of the socket to a predetermined depth, even when the semiconductor devices have different thicknesses.
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