Method of manufacturing an article comprising at least one electronic chip
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United States of America Patent
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Sep 30, 2008
Grant Date -
Aug 12, 2004
app pub date -
Jul 30, 2002
filing date -
Jul 30, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention provides a method of manufacturing an article comprising a fiber layer and at least one electronic chip, the fiber layer being formed by depositing fibers on a surface immersed in a dispersion of fiber material. The method includes the following step:Using an elongate flexible support to bring the electronic chip into contact with the fiber layer that is being formed.
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