Process for soldering an electronic component on an electronic card, process for repairing the card and installation for using the process
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United States of America Patent
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Sep 30, 2008
Issued Date -
N/A
app pub date -
Dec 16, 2004
filing date -
Dec 19, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A process for soldering an electronic component onto a support which includes at least one heat drain for the component. The method uses a solder paste which incorporates a stripping flux activated at a first temperature, and a solder alloy melted at a second temperature. The process includes preheating the support on the face opposite the component through the heat drain up to the first temperature, placing the component on the support with the solder paste, heating the component by applying a hot gas at a sufficiently high temperature to bring the solder alloy to the melting temperature.
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