Electronic circuit package
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United States of America Patent
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Sep 16, 2008
Grant Date -
Jul 12, 2007
app pub date -
Mar 7, 2007
filing date -
Feb 28, 1991
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An electronic apparatus which includes a wiring substrate which includes wiring conductors, and a plurality of semiconductor bare chips that are formed on the wiring substrate. The semiconductor bare chips include a processor for processing data and a circuit having a checking function for detecting faults of the processor.
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