Thermography test method and apparatus for bonding evaluation in sputtering targets
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United States of America Patent
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Sep 16, 2008
Grant Date -
Jul 7, 2005
app pub date -
Jul 13, 2004
filing date -
Jul 16, 2003
priority date (Note) -
Expired
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Abstract
A method and apparatus for thermographically evaluating the bond integrity of a sputtering target assembly is described. The method includes applying a heating or cooling medium or energy to one surface of the assembly and acquiring a graphic recording of a corresponding temperature change on the opposing surface of the assembly using an imaging device. Also described is a method of mathematically analyzing the pixel data recorded in each frame to produce an integrated normalized temperature map that represents the bond integrity of the assembly.
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