Fine pitch electrical interconnect assembly
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United States of America Patent
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Sep 9, 2008
Grant Date -
Mar 6, 2008
app pub date -
Nov 5, 2007
filing date -
Jul 16, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
An electrical interconnect assembly for electrically interconnecting terminals on a first circuit member with terminals on a second circuit member. The electrical interconnect assembly includes a housing having a plurality of through openings extending between a first surface and a second surface. A plurality of contact members are positioned in a plurality of the through openings. The contact members include a base portion and one or more beams. A layer is molded to the housing and the contact members to retain the contact members in the openings. A solder member is preferably coupled with an engagement feature on the base portion of the contact member.
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