Composition and method for treating a semiconductor substrate
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United States of America Patent
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Sep 9, 2008
Grant Date -
Nov 2, 2006
app pub date -
Jun 27, 2006
filing date -
Dec 18, 2003
priority date (Note) -
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Abstract
The invention relates to a method for cleaning semiconductor surfaces to achieve to removal of all kinds of contamination (particulate, metallic and organic) in one cleaning step. The method employs a cleaning solution for treating semiconductor surfaces which is stable and provokes less or no metal precipitation on the semiconductor surface.
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