Semiconductor chip package and application device thereof
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United States of America Patent
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Sep 2, 2008
Grant Date -
Mar 1, 2007
app pub date -
Nov 1, 2005
filing date -
Aug 30, 2005
priority date (Note) -
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Abstract
A semiconductor chip package has a pillar body including at least three conductors insulated from each other by an insulating layer. The pillar body has a periphery that includes a plurality of mounting faces, with each mounting face defined by two adjacent conductors separated by a portion of the insulating layer. A plurality of semiconductor chips are attached on the mounting faces and selectively and electrically connected to the conductors. The semiconductor package of the present invention can be used in a semiconductor illuminator which has a housing having a reflecting cup, with the pillar body positioned inside the reflecting cup.
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