Circuit board with trace configuration for high-speed digital differential signaling
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United States of America Patent
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Aug 26, 2008
Grant Date -
Nov 23, 2006
app pub date -
Jul 26, 2006
filing date -
Jun 12, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Trace configurations for carrying high-speed digital differential signals provide for reduced conduction loss and improved signal integrity. In one embodiment, a circuit board has a first set of conductive traces disposed on non-conductive material, and a second set of conductive traces parallel to the first set and disposed within the conductive material. The second set is separated from the first set by non-conductive material. Corresponding traces of the first and second sets may be in a stacked configuration. In other embodiments, conductive material may be provided between corresponding traces of the first and second sets resulting in an 'I-shaped' or 'U-shaped' cross-section. In yet other embodiments, the trace configurations have 'T-shaped' and 'L-shaped' cross-sections.
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