Process for forming metal layers
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 26, 2008
Grant Date -
May 12, 2005
app pub date -
Jun 16, 2004
filing date -
Jun 18, 2003
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A process in which a base metal film is formed on the surface of a plastic film using a dry plating process, and a liquid containing an organic monomer is then brought in contact with the base metal film, thereby selectively forming a conductive organic polymer coating within any pinhole defects, and effectively filling the defects. A metal film is then formed on top of the base metal film using an electroplating process, thus forming a metal wet plating layer.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully