Process for forming metal layers

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United States of America Patent

PATENT NO 7416763
APP PUB NO 20050097735A1
SERIAL NO

10870671

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A process in which a base metal film is formed on the surface of a plastic film using a dry plating process, and a liquid containing an organic monomer is then brought in contact with the base metal film, thereby selectively forming a conductive organic polymer coating within any pinhole defects, and effectively filling the defects. A metal film is then formed on top of the base metal film using an electroplating process, thus forming a metal wet plating layer.

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Patent Owner(s)

Patent OwnerAddress
COOKSON ELECTRONICS CO480-28 HIGASHI-TOYODA HIRATSUKA-SHI KANAGAWA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Abe, Takashi Ichikawa, JP 355 3021
Kanda, Yuichi Aizuwakamatsu, JP 7 81
Nishu, Keisuke Tokyo, JP 5 36
Tanaka, Atsushi Tokyo, JP 574 12836

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  • 10 Citation Count
  • B05D Class
  • 5.51 % this patent is cited more than
  • 17 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges454601577930221161501 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7081 - 90100 +0255075100125150175200225250275300325350375400425450475500

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