Process for forming metal layers
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Aug 26, 2008
Grant Date -
May 12, 2005
app pub date -
Jun 16, 2004
filing date -
Jun 18, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A process in which a base metal film is formed on the surface of a plastic film using a dry plating process, and a liquid containing an organic monomer is then brought in contact with the base metal film, thereby selectively forming a conductive organic polymer coating within any pinhole defects, and effectively filling the defects. A metal film is then formed on top of the base metal film using an electroplating process, thus forming a metal wet plating layer.
First Claim
all claims..Other Claims data not available
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
COOKSON ELECTRONICS CO | 480-28 HIGASHI-TOYODA HIRATSUKA-SHI KANAGAWA |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Abe, Takashi | Ichikawa, JP | 355 | 3021 |
# of filed Patents : 355 Total Citations : 3021 | |||
Kanda, Yuichi | Aizuwakamatsu, JP | 7 | 81 |
# of filed Patents : 7 Total Citations : 81 | |||
Nishu, Keisuke | Tokyo, JP | 5 | 36 |
# of filed Patents : 5 Total Citations : 36 | |||
Tanaka, Atsushi | Tokyo, JP | 574 | 12836 |
# of filed Patents : 574 Total Citations : 12836 |
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Patent Citation Ranking
- 10 Citation Count
- B05D Class
- 5.51 % this patent is cited more than
- 17 Age
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
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Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

Legal Events
Date | Code | Event | Description |
---|---|---|---|
Nov 30, 2024 | PD | Priority Date | |
Mar 21, 2023 | MAFP | MAINTENANCE FEE PAYMENT | free format text: PAYMENT OF MAINTENANCE FEE, 8TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1552); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY year of fee payment: 8 |
Jan 01, 2021 | AS | ASSIGNMENT | free format text: MERGER;ASSIGNOR:METSO MINERALS INDUSTRIES INC.;REEL/FRAME:061817/0432 Owner name: METSO OUTOTEC USA INC., WISCONSIN Effective Date: Jan 01, 2021 |
Mar 13, 2019 | MAFP | MAINTENANCE FEE PAYMENT | free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY year of fee payment: 4 |
Oct 13, 2015 | I | Issuance | |
Sep 23, 2015 | STCF | INFORMATION ON STATUS: PATENT GRANT | free format text: PATENTED CASE |
Jan 10, 2013 | P | Published | |
Jul 08, 2011 | F | Filing | |
Jul 07, 2011 | AS | ASSIGNMENT | free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MARKS, WALTER R.;SNOW, EDWARD L.;REEL/FRAME:026650/0188 Owner name: METSO MINERALS INDUSTRIES, INC., WISCONSIN Effective Date: Jul 07, 2011 |

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