Conductive adhesive bond
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 26, 2008
Grant Date -
Nov 20, 2003
app pub date -
May 16, 2003
filing date -
May 18, 2002
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Conductive adhesive bonds are used preferably where the contact bonds are subject to great temperature variations, for example, on a throttle valve controller. In order to increase the mechanical stabilization of the conductive adhesive bonds, the surface of the contacts are machined and provided with structures such as ribbing, prickles, etc. As a result of this structuring, the conductive adhesive interlocks mechanically at these points. This leads to a high contact reliability also at extreme temperature changes.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully