Method and apparatus for mounting semiconductor chips
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United States of America Patent
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Aug 26, 2008
Grant Date -
Jan 5, 2006
app pub date -
Jul 1, 2005
filing date -
Jul 2, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for mounting semiconductor chips onto a substrate with which substrate places are arranged in columns, whereby the semiconductor chips adhering to a foil are presented on a wafer table, whereby the detachment of a semiconductor chip from the foil is supported by means of a die ejector and whereby a pick and place device picks the semiconductor chip presented above the die ejector and deposits it onto the substrate comprises: Forward feeding the substrate along a transport direction designated as x direction, Equipping a predetermined number of columns with semiconductor chips in accordance with the steps: Moving the pick and place device to an x position corresponding to the column to be equipped, Moving the die ejector to this x position, and Equipping the substrate places of the column.
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