Right angle blister plus header card package
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United States of America Patent
Stats
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Aug 19, 2008
Grant Date -
May 29, 2008
app pub date -
Nov 29, 2006
filing date -
Nov 29, 2006
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An improved blister package construction is provided. The inventive blister package construction allows for different visual presentations of the packaged products that would otherwise not be achievable with conventional blister packages. The blister package of the invention has one or two thermoplastic blisters designed and positioned on a backing card such that, when the card is folded along a transverse score line, the one or two blisters will lock together and the backing card will be formed into an 'L' shaped configuration.
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