Electrostatic chucking device and manufacturing method thereof
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United States of America Patent
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Aug 12, 2008
Grant Date -
Aug 19, 2004
app pub date -
Feb 10, 2004
filing date -
Aug 16, 2000
priority date (Note) -
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Abstract
An electrostatic chucking device having a laminated structure formed by sequentially laminating a first insulation layer, an electrode layer, and a second insulation layer on a metal substrate. The first and second insulation layers are formed from polyimide films. At least one adhesion layer is provided between the metal substrate and the first insulation layer, and is a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 .mu.m.
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