Resin molding equipment and resin molding method
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United States of America Patent
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Aug 5, 2008
Grant Date -
May 4, 2006
app pub date -
Nov 1, 2005
filing date -
Nov 2, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
The resin molding equipment comprises: a work piece feeding section; a work piece measuring section measuring thickness of a semiconductor chip mounted on a work piece; a resin supplying section supplying liquid resin to the work piece; a resin molding section having a molding die for molding the work piece with the liquid resin; a product measuring section measuring thickness of a resin molded part of the molded product; a product accommodating section; and a control section for controlling the sections. The control section includes means for adjusting an amount of the liquid resin, which is supplied to the work piece by the resin supplying section, on the basis of the thickness measured by the work piece measuring section.
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