Composite material and resin mold

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7407146
APP PUB NO 20050154113A1
SERIAL NO

11024484

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A composite material used for a resin mold for forming hardened resin by hardening fluid resin is provided. The composite material comprises a first material having excellent wear resistance against the fluid resin and a second material having excellent unwettability against the fluid resin. The resin mold comprises a substrate of the first material, a large number of pores each provided to form an opening on a surface of the substrate opposite to the fluid resin and a film of the second material formed along the inner wall surface of each pore at least around the opening. Each of the large number of pores is a communicating hole connecting the surface opposite to the fluid resin and the remaining surface with each other. Therefore, releasability between a mold surface and the hardened resin and wear resistance of the composite material against the fluid resin can be improved.

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Patent Owner(s)

Patent OwnerAddress
TOWA CORPORATIONKYOTO JAPAN
JAPAN FINE CERAMICS CENTERNAGOYA-SHI AICHI 456-8587

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kawashima, Naoki Nagoya, JP 24 122
Kitaoka, Satoshi Nagoya, JP 44 158
Kuno, Takaki Kyoto, JP 13 40
Maeda, Keiji Kyoto, JP 32 211
Noguchi, Yosinori Kyoto, JP 1 1

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