Method for mounting a semiconductor chip onto a substrate
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United States of America Patent
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Aug 5, 2008
Grant Date -
Jun 8, 2006
app pub date -
Dec 5, 2005
filing date -
Dec 6, 2004
priority date (Note) -
Expired
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Abstract
A method for mounting a semiconductor chip onto a substrate the side of which facing towards the substrate is coated with an adhesive layer is characterised by the following steps: (1) Lowering the semiconductor chip until the semiconductor chip touches the substrate, (2) Waiting a predetermined period of time during which a force exerted on the semiconductor chip disappears or is at least comparatively small, and (3) Applying a bond force.
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