Apparatus and method for breaking in multiple pad conditioning disks for use in a chemical mechanical polishing system
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United States of America Patent
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Jul 29, 2008
Grant Date -
Dec 22, 2005
app pub date -
Jun 22, 2004
filing date -
Jun 22, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An apparatus for breaking in new pad conditioning disks for use in a chemical mechanical polishing (CMP) system that polishes a semiconductor wafer by pressing the semiconductor wafer against a moving polishing pad. The apparatus comprises a break-in head that is removably attached to a drive shaft to which a polishing head that holds the semiconductor wafer is normally attached. The break-in head holds multiple pad conditioning disks and presses the plurality of pad conditioning disks against the moving polishing pad. The break-in head comprises a drive mechanism for rotating the multiple pad conditioning disks. The drive mechanism is coupled to the drive shaft and rotates the multiple pad conditioning disks by translating a rotating motion of the drive shaft into rotating motions of the multiple pad conditioning disks.
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