Quad flat no-lead (QFN) chip package assembly apparatus and method
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United States of America Patent
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Jul 22, 2008
Grant Date -
Jan 10, 2008
app pub date -
Jul 10, 2006
filing date -
Jul 10, 2006
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Abstract
In one embodiment the present invention includes a method of fabricating a quad flat no-lead (QFN) chip package. The method includes forming a stamped lead frame; forming a die pad and a lead shrink on one side of the stamped lead frame; mounting a die on the die pad; performing wire bonding; encapsulating the die and the wire bond with a molding compound; removing the stamped lead frame after encapsulating; and sawing the molding compound after the stamped lead frame has been removed. Such method results in improved quality of wire leads, improved lifespan of cutting blades, and reduction of burrs as compared to many existing methods of fabricating QFN chip packages.
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