System and method for detection of spatial signature yield loss
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United States of America Patent
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Jul 15, 2008
Grant Date -
Jul 12, 2007
app pub date -
Feb 15, 2007
filing date -
Jan 14, 2005
priority date (Note) -
Expired
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Abstract
A system for identifying systematic yield losses comprises a device configured to test produced products using a test sequence that produces yield data related to a wafer. The wafer is divided into multiple zones. Series of yield data may be collected and stored for each zone. A first data series R1 is the yield of a zone; a second data series R2 is a p consecutive element moving average of data series R1; and a third data series R3 is a p consecutive element moving standard deviation of data series R1. A device is configured to calculate a trigger point for each element of R1, wherein the trigger point is calculated as the respective R2 element less an adjusted respective R3 value. A notification may be provided to a user when the trigger point calculated for each element of R1 is greater than the respective element of R1.
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