Transverse-transfer of optical power between assembled waveguides

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United States of America Patent

PATENT NO 7394954
APP PUB NO 20070081781A1
SERIAL NO

11559520

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A substantially flat upper cladding surface over a waveguide core facilitates transverse-coupling between assembled waveguides, and/or provides mechanical alignment and/or support. An embedding medium may be employed for securing optical assemblies and protecting optical surfaces thereof. Structural elements fabricated with a low-profile core may be employed for providing mechanical alignment and/or support, aiding in the encapsulation process, and so forth.

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Patent Owner(s)

Patent OwnerAddress
HOYA CORPORATION USA680 NORTH MCCARTHY BLVD SUITE 120 MILPITAS CA 95035

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Blauvelt, Henry A San Marino, CA 73 2004
Hunzicker, Guido Altadena, CA 1 6
Paslaski, Joel S Alhambra, CA 41 900
Vernooy, David W Sierra Madre, CA 53 1265

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