Encapsulation of electronic devices
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United States of America Patent
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Jul 1, 2008
Grant Date -
May 22, 2003
app pub date -
Nov 20, 2001
filing date -
Dec 17, 1999
priority date (Note) -
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Abstract
An encapsulation for a device is disclosed. Spacer particles are randomly located in the device region to prevent a cap mounted on the substrate from contacting the active components, thereby protecting them from damage. The spacer particles are fixed to one side of the substrate to prevent any movement.
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