MOSFET package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Jul 1, 2008
Grant Date -
Feb 22, 2007
app pub date -
Oct 31, 2006
filing date -
Jan 28, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body containing a second precious metal.
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