System and method for encapsulation and protection of components
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United States of America Patent
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Jun 24, 2008
Grant Date -
Jan 5, 2006
app pub date -
Jul 2, 2004
filing date -
Jul 2, 2004
priority date (Note) -
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Abstract
A system and method for encapsulating and protecting a component assembly is disclosed. A barrier system comprising a first layer having a first set of physical properties and a second layer having a second set of physical properties is adapted to protectively surround the component assembly. A continuous transitory material is formed between the first layer and the second layer at associated first and second margin portions such that the first layer and the second layer are not prone to delamination. The physical properties of each layer of the barrier system provide protection to the component assembly from various types of physical and environmental damage.
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