Method for an element using two resist layers

United States of America Patent

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Jun 17, 2008
Grant Date
May 10, 2007
app pub date
Nov 10, 2005
filing date
Nov 10, 2005

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Expired

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Abstract

A two resist layer process allows a seed layer to be used to electroplate a conductive layer of an element in a way that a portion of the seed layer can be removed.

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Patent Owner	Address
SQUARE 1 BANK	406 BLACKWELL STREET SUITE 240 LEE CONNER DURHAM NC 27701

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H01Q:AERIALS

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Inventor Name	Address	# of filed Patents	Total Citations
Garby, Sandra M	Bangor, PA	1	4
Oberle, Robert R	Macungie, PA	31	656

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Method for an element using two resist layers

Number of patents in Portfolio can not be more than 2000

United States of America Patent

11271361

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PATENT NO	7388542
APP PUB NO	20070103379A1
SERIAL NO	11271361
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity Expired	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
June 17, 2008	US,7388542,B2 US7388542B2	GRANTED PATENT AS SECOND PUBLICATION
May 10, 2007	US,20070103379,A1 US20070103379A1	FIRST PUBLISHED PATENT APPLICATION

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11271361

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